RESEARCH SCOPE
Pioneering Intelligent Convergent Technologies for the Intelligent Device Applications
At LiDM Laboratory, we are at the forefront of cutting-edge interdisciplinary research spanning mechanical, electrical, materials, and biomedical engineering. Our work extends into next-generation fields such as artificial intelligence (AI), intelligent semiconductors, neuromorphic devices and semiconductor packaging, driving innovations that will shape the future. We go beyond conventional research by developing mechanically soft, highly durable, and high-performance devices, aiming to revolutionize human life through groundbreaking technology.
Breaking Boundaries in Advanced Materials and Devices for Soft Electronics
Our team specializes in structural design of materials and its impact on mechanical and electrical properties, laying the foundation for future intelligent systems. We strive to develop ultra-reliable materials and micro/nanoscale devices that power soft robotics, flexible/stretchable electronics, and smart healthcare applications. By integrating cutting-edge AI-based design approaches and semiconductor technologies, we push the boundaries of high-performance, energy-efficient, and long-lasting materials and devices.
Semiconductor Packaging: Higher-Density IC Integration
At Lidm, we are pioneering advanced semiconductor packaging technologies to drive the next era of high-performance, energy-efficient, and ultra-reliable electronics. As chips become smaller and more powerful, our research focuses on thermal management, mechanical reliability, and high-density integration to overcome the challenges of modern semiconductor devices.
Revolutionizing Tribology: Infinite Wear Resistance
Our advancements in ultra-low friction open doors to high-performance micro-systems, space technology, and ultra-clean environments where conventional lubrication is impossible. From precision engineering to next-gen optical and flexible devices, our discoveries are set to redefine surface protection and system efficiency.